QBT-E Dual-chamber Ultra-high Vacuum Electron Beam Evaporator
Product Overview
QBT-E system is a type of standard evaporation system with two process chambers: load-lock (pre-treatment) chamber and evaporator. UHV background enables high quality film deposition: metal, dielectric materials, optical films, magnetic films and so on. Sample manipulation includes tilting and rotation, or Z-stroke and rotation, enabling planetary or 3D structures.
Technical Advantages
UHV Chamber: 2 chambers, Loadlock and Evaporator
Loadlock Ultimate Pressure: <9E-9Torr
E-beam Evaporation Chamber Ultimate Pressure: ≤3E-9 Torr
Wafer Heating: RT-600oC
Wafer Transfer: Automatic wafer transfer
HMI: Fully Automated Human-Machine Interface
Sample Size: Max 8 inch wafer and smaller chips compatible
Uniformity: Sheet Resistance Uniformity 1 Sigma NU%<±2% (8 inch wafer with 5 mm removal from the edge)
Wafer Tilt and Rotation: Capable of 180° tilting and 360° rotation with 0.1° precision control, optional lift/rotation stages with water, cryogenic (-70°C), or LN2 cooling configurations
