PVD-100 Dual-chamber High Vacuum Magnetron Sputtering System
Product Overview
PVD-100 includes two ultra-high vacuum chambers Load Lock and Sputtering, equipped with a fully automatic operation interface. RF power supplies are compatible with metallic or non-metallic materials.
Technical Advantages
Wafer Heating: RT-900oC
Wafer Transfer: Highly reliable and repeatable substrate transferring capability
UHV Chamber: 2 UHV Chambers, Loadlock and Sputtering
Ultimate Pressure: <5E-8Torr
Pumping Spead: From ATM to 1E-7Torr<20min (loadlock)
Sputtering: DC or RF power supply, wafer and target space can change continoulsly
Ion Milling: Kaufman Ion Source, Ion Energy 100-600eV, 100-1200eV; Ion Beam Current: 20-200mA, Etching uniformity <±6% on ?100 mm substrates
HMI: Fully Automated Human-Machine Interface
