QBT-MPVMulti-target Ultra-high Vacuum Magnetron Vertical Sputtering System
Product Overview
QBT-MPV is an upgraded system from QBT-P. Compared to QBT-P, QBT-MPV includes up to 4 magnetron cathodes (upon request) in one sputtering chamber, enabling multi-layer process, such as Nb/Al-AlOx/Nb, Al/AlOx/Al, or even α-Ta/TaOx/α-Ta junctions. The system is also compatible with seed layer based process.
Technical Advantages
Dimension(L x W x H): 2600*1600*2200 mm
Process Chamber Ultimate Pressure: ≤3E-9 Torr
Process Temperature: 0-900°C or water cooled positions
Sample Size: Max 4 inch Wafer and smaller chips compatible
Uniformity: <±5% (4 inch wafer with 5 mm removal from the edge)
Power Supply: 1kW DC power or 750W RF (Upon request)
Magnetron Cathode: Four 4-6 inch Ultra High Vacuum Magnetron Cathodes（Upon request）
